3M™ Thermally Conductive Acrylic Interface Pad 5571-1.0, White, 300 mm x 20 m x 1.0 mm, 1 Roll/Case
- 3M ID 7000100771
- UPC 00051115527739
Details
Hoogtepunten
- High thermal conductivity, 2.0 W/m-K on plane direction
- Good softness and conformability even to non-flat IC surfaces and heat spreading blocks
- Passes UL 94 V-2 flame retardance test
- No siloxane outgassing or oil bleeding
- Soft compliant material allows for pressure relaxation, preventing high pressure zones on components
- Good electrical insulation properties
- Slight tack allows easy pre-assembly
3M™ Thermally Conductive Acrylic Interface Pad 5571 is a moderately conformable and medium-soft pad with high thermal conductivity of 2.0 W/m-K (ASTM C113). This pad consists of a slightly tacky acrylic elastomeric sheet filled with thermally conductive ceramic particles. It is designed to transfer heat from heat generating components to heat sinks and cooling devices, improving device reliability and extending the component's life.
3M™ Thermally Conductive Acrylic Interface Pad 5571 has a medium-soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Our family of 3M™ Thermally Conductive Acrylic Interface Pads provide low-outgassing and high-performance solutions compared to silicone. These acrylic pads have no siloxane VOC or oil bleeding, which are associated with silicone products and can often cause device failure. They are lightweight, making them ideal for applications with finer spacing requirements and a small footprint. 3M™ Thermally Conductive Acrylic Interface Pads have good electrical insulation properties to protect against electrical interference and device breakdown.
Recommended Applications:
Heat transfer between PCB and heat sink
Decrease of compression stress to electronic parts by thermal pad softness
Gap filling in electronic devices
Chip on film (COF) heat dissipation
Power electronic component thermal management
Examples:
LED displays
Electric vehicle (EV) batteries
Wireless charging units
Satellite navigation
Sensors
Process control equipment
Test & measurement devices
Specificaties
Hulpmiddelen
Neem contact met ons op. Wij staan klaar om u te helpen.
Stuur ons een bericht
Bedankt voor uw interesse in 3M. Om ons te helpen uw vraag effectief te beheren en te beantwoorden, vragen we u vriendelijk om wat belangrijke informatie te verstrekken, waaronder uw contactgegevens. De door u verstrekte informatie, wordt gebruikt om op uw verzoek te reageren via e-mail of telefoon door een 3M vertegenwoordiger of door een van onze geautoriseerde zakenpartners waarmee we mogelijk uw persoonsgegevens zullen delen in overeenstemming met het 3M privacybeleid.
Badankt voor het contact opnemen met 3M
Wij hebben uw bericht ontvangen en bekijken momenteel uw aanvraag
Een van onze vertegenwoordigers neemt contact met u op via telefoon of email.
An error occurred.
